Full wafer cathodoluminescence microscope
The Säntis 300 system has been designed for fully automated control of 150, 200 and 300mm wafers.
Attolight’s Quantitative CL-SEMs offer “No Compromise” large field fast scanning simultaneous acquisition of SEM image, hyperspectral CL maps, and optical spectra.
Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
The Santis 300 system offers 3 distinct acquisition modes: step and repeat (S&R), continuous scanning mode (AWpix), integrative scanning mode (FWbrush)
up to 300 mm wafer tool
High CL-SEM throughput
Simultaneous SEM imaging and Optical signature acquisition
Edge detection for accurate wafer positioning (better than 10µm)
Automated wafer bow mapping and correction
Various system configurations are available, the system is fully upgradeable from P1 to P3:
P1: manual loading system, no loadlock
P2: manual loading system, loadlock
P3c: open cassette system
P3e: EFEM system
Attolight Quantitative Cathodoluminescence
The Attolight Quantitative Cathodoluminescence comprises a custom designed electron column with tightly integrated light collection optics.
The light collection optics featured a field of view of up to 300 μm. The light detection path is carefully optimized and fully aperture matched to guarantee highest light collection uniformity (+-1%) over the FOV. The carefully integrated design and optimization of light and electron optics make high measurement speeds, accuracy and repeatability possible. Quantitative CL produces UV-Visible and NIR hyperspectral maps (full emission spectrum in every pixel) or panchromatic maps (intensity of defined wavelength in every pixel).
Attolight Säntis 300 system offers 3 distinctive acquisition modes, tailored for different needs and applications:
Step and repeat
Traditional frozen mapping allowing repetitive acquisitions at fixed locations spread over the wafer. Measurements and analysis parameters can be defined and stored in a recipe database.
AWpix (across wafer pixel) imaging (patent pending)
innovative full measurement of the wafer area allowing
medium resolution imaging of the whole wafer.
Partial wafer imaging possible. Measurements and analysis parameters can be defined and stored in a recipe database.
Down to 0.1 µsec per pixel (intensity at given wavelength)
0.5 to 2.5 µm pixel Simultaneous SE image
< 2.5 h per wafer for 100 % coverage of a 150 mm diameter wafer
Innovative high speed measurement of the wafer area allowing low resolution imaging of the whole wafer. Partial wafer imaging possible. Measurements and analysis parameters can be defined and stored in a recipe database
Down to 0.1 µsec per pixel (intensity at given wavelength) Down to 1 msec per pixel (Full spectra)
300 µm pixel Simultaneous SE image
Up to 4 wafers per hour for 100% coverage of 150 mm diameter wafers
FWbrush (full wafer brush) imaging (patent pending)
Tool weight :
Main unit : ~2750 kg
Delivered linked together with caster to allow rolling in place.
Primary pump can be remotely located
Operator manually loading wafer into the loadlock of a Säntis 300 P2 tool